Inventor
LUM WEN WEI
MY6 patents
⚠️ This page may combine multiple inventors who share the name “LUM WEN WEI”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
INTEL CORP
4 patentsUS11121074B2Sep 14, 2021
Packaged die stacks with stacked capacitors and methods of assembling same
INTEL CORP3 citations71
US10998261B2May 4, 2021
Over-molded IC package with in-mold capacitor
INTEL CORP4 citations71
US10593618B2Mar 17, 2020
Packaged die stacks with stacked capacitors and methods of assembling same
INTEL CORP3 citations71
US10541200B2Jan 21, 2020
Over-molded IC packages with embedded voltage reference plane and heater spreader
INTEL CORP1 citations61