Inventor
GOKHALE SHRIPAD
US9 patents
Patents
9 patentsUS7875503B2Jan 25, 2011
Reducing underfill keep out zone on substrate used in electronic device processing
INTEL CORP11 citations79
US7687890B2Mar 30, 2010
Controlling substrate surface properties via colloidal coatings
INTEL CORP7 citations69
US9508610B2Nov 29, 2016
Inline measurement of molding material thickness using terahertz reflectance
INTEL CORP5 citations68
US12417958B2Sep 16, 2025
Microelectronics package comprising a package-on-package (PoP) architecture with inkjet barrier material for controlling bondline thickness and PoP adhesive keep out zone
INTEL CORP0 citations59
US12347743B2Jul 1, 2025
Microelectronics package comprising a package-on-package (PoP) architecture with inkjet barrier material for controlling bondline thickness and pop adhesive keep out zone
INTEL CORP0 citations59
US12315777B2May 27, 2025
Microelectronics package comprising a package-on-package (POP) architecture with inkjet barrier material for controlling bondline thickness and POP adhesive keep out zone
INTEL CORP0 citations59
US8362627B2Jan 29, 2013
Reducing underfill keep out zone on substrate used in electronic device processing
INTEL CORP3 citations58
US12394773B2Aug 19, 2025
Laser ablation-based surface property modification and contamination removal
INTEL CORP0 citations55
US12362340B2Jul 15, 2025
Laser ablation-based surface property modification and contamination removal
INTEL CORP0 citations55