Inventor
SHIH HSUAN-NING
TW4 patents
Patents
4 patentsUS11855030B2Dec 26, 2023
Package structure and method of manufacturing the same
TAIWAN SEMICONDUCTOR MFG CO LTD2 citations69
US11069642B2Jul 20, 2021
Package structure and method of manufacturing the same
TAIWAN SEMICONDUCTOR MFG CO LTD5 citations69
US12094836B2Sep 17, 2024
Semiconductor device having heat dissipation structure of curved profile and a manufacturing method thereof
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations51
US12538835B2Jan 27, 2026
Integrated chip package including a crack-resistant lid structure and methods of forming the same
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations50