Inventor
HAYAKAWA HIDEAKI
JP10 patents
⚠️ This page may combine multiple inventors who share the name “HAYAKAWA HIDEAKI”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
SONY CORP
8 patentsUS5498565AMar 12, 1996
Method of forming trench isolation having polishing step and method of manufacturing semiconductor device
SONY CORP137 citations97
US5779520AJul 14, 1998
Method and apparatus of polishing wafer
SONY CORP76 citations95
US6077155AJun 20, 2000
Polishing device and correcting method therefor
SONY CORP22 citations92
US5681212AOct 28, 1997
Polishing device and correcting method therefor
SONY CORP27 citations92
US5502008AMar 26, 1996
Method for forming metal plug and/or wiring metal layer
SONY CORP30 citations92
US5254171AOct 19, 1993
Bias ECR plasma CVD apparatus comprising susceptor, clamp, and chamber wall heating and cooling means
SONY CORP52 citations92
US6126511AOct 3, 2000
Polishing device and correcting method therefor
SONY CORP8 citations73
USRE38363EDec 23, 2003
Method of forming trench isolation having polishing step and method of manufacturing semiconductor device
SONY CORP6 citations62