P

Inventor

LEE WOONG SUN

KR12 patents
⚠️ This page may combine multiple inventors who share the name “LEE WOONG SUN”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

HYNIX SEMICONDUCTOR INC

3 patents
US8053879B2Nov 8, 2011

Stacked semiconductor package and method for fabricating the same

HYNIX SEMICONDUCTOR INC53 citations96
US7880093B2Feb 1, 2011

3-dimensional substrate for embodying multi-packages and method of fabricating the same

HYNIX SEMICONDUCTOR INC11 citations82
US7859108B2Dec 28, 2010

Flip chip package and method for manufacturing the same

HYNIX SEMICONDUCTOR INC1 citations51

LEE WOONG SUN

3 patents
US8441116B2May 14, 2013

Semiconductor package having substrate for high speed semiconductor package

LEE WOONG SUN4 citations59
US8129627B2Mar 6, 2012

Circuit board having semiconductor chip

LEE WOONG SUN0 citations49
US8445322B2May 21, 2013

Method of fabricating semiconductor package

LEE WOONG SUN0 citations48

KOREA ADVANCED INST SCI & TECH

2 patents
US6110276AAug 29, 2000

Method for making n-type semiconductor diamond

KOREA ADVANCED INST SCI & TECH12 citations73
US7387910B2Jun 17, 2008

Method of bonding solder pads of flip-chip package

KOREA ADVANCED INST SCI & TECH6 citations62

KIM KI YOUNG

1 patent
US8399998B2Mar 19, 2013

Semiconductor package requiring reduced manufacturing processes

KIM KI YOUNG2 citations60

BAE HAN JUN

1 patent
US8618637B2Dec 31, 2013

Semiconductor package using through-electrodes having voids

BAE HAN JUN0 citations47

KIM SI HAN

1 patent
US8558380B2Oct 15, 2013

Stack package and method for manufacturing the same

KIM SI HAN0 citations41

BAE JIN HO

1 patent
US8796834B2Aug 5, 2014

Stack type semiconductor package

BAE JIN HO0 citations40