Inventor

CHUNG QWAN HO

KR31 patents

⚠️ This page may combine multiple inventors who share the name “CHUNG QWAN HO”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

CHUNG QWAN HO

HYNIX SEMICONDUCTOR INC

Stacked semiconductor package and method for fabricating the same

Lightweight and compact through-silicon via stack package with excellent electrical connections and method for manufacturing the same

Lightweight and compact through-silicon via stack package with excellent electrical connections and method for manufacturing the same

Semiconductor package having chip selection through electrodes and stacked semiconductor package having the same

Wafer level package configured to compensate size difference in different types of packages

Semiconductor chip package and method for fabricating the same

Semiconductor device and semiconductor package having the same

Semiconductor package with improved size, reliability, warpage prevention, and heat dissipation and method for manufacturing the same

Semiconductor package with improved size, reliability, warpage prevention, and heat dissipation and method for manufacturing the same

Stacked semiconductor package in which semiconductor packages are connected using a connector

Semiconductor chip package and method for fabricating the same

Semiconductor device and semiconductor package having the same

Semiconductor device and semiconductor package having the same

SK HYNIX INC

Electronic device packages having bumps and methods of manufacturing the same

Substrates having ball lands, semiconductor packages including the same, and methods of fabricating semiconductor packages including the same

Semiconductor package having EMI shielding and method of fabricating the same

Embedded packages, methods of fabricating the same, electronic systems including the same, and memory cards including the same

Embedded package and method for manufacturing the same

Package stacked device

Electrical characteristics of package substrates and semiconductor packages including the same

Semiconductor package and method for manufacturing the same

CHUNG QWAN HO

Embedded package and method for manufacturing the same

Semiconductor package for discharging heat and method for fabricating the same

Semiconductor package for discharging heat and method for fabricating the same

LEE WOONG SUN

Semiconductor package having substrate for high speed semiconductor package

Circuit board having semiconductor chip

Method of fabricating semiconductor package

KIM SEUNG JEE

Electronic device packages having bumps and methods of manufacturing the same

KIM KI YOUNG

Bump for semiconductor package, semiconductor package having bump, and stacked semiconductor package

LEE KYU WON

Substrate for semiconductor package, semiconductor package including the same, and stack package using the semiconductor package

BAE JIN HO

Stack type semiconductor package