Inventor
SPROGIS EDMUND JURIS
US22 patents
⚠️ This page may combine multiple inventors who share the name “SPROGIS EDMUND JURIS”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
IBM
19 patentsUS7557597B2Jul 7, 2009
Stacked chip security
IBM231 citations99
US6507115B2Jan 14, 2003
Multi-chip integrated circuit module
IBM312 citations99
US6294406B1Sep 25, 2001
Highly integrated chip-on-chip packaging
IBM120 citations99
US5977640ANov 2, 1999
Highly integrated chip-on-chip packaging
IBM585 citations99
US7193423B1Mar 20, 2007
Wafer-to-wafer alignments
IBM231 citations98
US6225699B1May 1, 2001
Chip-on-chip interconnections of varied characteristics
IBM98 citations98
US7276787B2Oct 2, 2007
Silicon chip carrier with conductive through-vias and method for fabricating same
IBM124 citations96
US5935763AAug 10, 1999
Self-aligned pattern over a reflective layer
IBM213 citations96
US7851923B2Dec 14, 2010
Low resistance and inductance backside through vias and methods of fabricating same
IBM16 citations92
US7563714B2Jul 21, 2009
Low resistance and inductance backside through vias and methods of fabricating same
IBM35 citations92
US7348210B2Mar 25, 2008
Post bump passivation for soft error protection
IBM25 citations92
US6642080B1Nov 4, 2003
Chip-on-chip interconnections of varied characterstics
IBM18 citations92
US5923181AJul 13, 1999
Methods and apparatus for burn-in stressing and simultaneous testing of semiconductor device chips in a multichip module
IBM41 citations90
US5686843ANov 11, 1997
Methods and apparatus for burn-in stressing and simultaneous testing of semiconductor device chips in a multichip module
IBM30 citations90
US7678696B2Mar 16, 2010
Method of making through wafer vias
IBM16 citations84
US8004289B2Aug 23, 2011
Wafer-to-wafer alignments
IBM5 citations71
US7474104B2Jan 6, 2009
Wafer-to-wafer alignments
IBM5 citations68
US7741722B2Jun 22, 2010
Through-wafer vias
IBM5 citations62
US7898063B2Mar 1, 2011
Through substrate annular via including plug filler
IBM3 citations61