Inventor
TAO RONG
US17 patents
⚠️ This page may combine multiple inventors who share the name “TAO RONG”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
APPLIED MATERIALS INC
12 patentsUS6207222B1Mar 27, 2001
Dual damascene metallization
APPLIED MATERIALS INC120 citations99
US5989623ANov 23, 1999
Dual damascene metallization
APPLIED MATERIALS INC146 citations99
US6139697AOct 31, 2000
Low temperature integrated via and trench fill process and apparatus
APPLIED MATERIALS INC117 citations98
US6627542B1Sep 30, 2003
Continuous, non-agglomerated adhesion of a seed layer to a barrier layer
APPLIED MATERIALS INC64 citations96
US6610184B2Aug 26, 2003
Magnet array in conjunction with rotating magnetron for plasma sputtering
APPLIED MATERIALS INC44 citations96
US6875321B2Apr 5, 2005
Auxiliary magnet array in conjunction with magnetron sputtering
APPLIED MATERIALS INC26 citations92
US6200433B1Mar 13, 2001
IMP technology with heavy gas sputtering
APPLIED MATERIALS INC45 citations92
US10047430B2Aug 14, 2018
Self-ionized and inductively-coupled plasma for sputtering and resputtering
APPLIED MATERIALS INC5 citations73
US11075165B2Jul 27, 2021
Methods and apparatus for forming dual metal interconnects
APPLIED MATERIALS INC2 citations69
US11948885B2Apr 2, 2024
Methods and apparatus for forming dual metal interconnects
APPLIED MATERIALS INC0 citations59
US10304732B2May 28, 2019
Methods and apparatus for filling substrate features with cobalt
APPLIED MATERIALS INC0 citations51
US10014179B2Jul 3, 2018
Methods for forming cobalt-copper selective fill for an interconnect
APPLIED MATERIALS INC0 citations41