Inventor
REDEKER FRITZ
US36 patents
⚠️ This page may combine multiple inventors who share the name “REDEKER FRITZ”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
LAM RES CORP
20 patentsUS7234477B2Jun 26, 2007
Method and apparatus for drying semiconductor wafer surfaces using a plurality of inlets and outlets held in close proximity to the wafer surfaces
LAM RES CORP55 citations95
US7615480B2Nov 10, 2009
Methods of post-contact back end of the line through-hole via integration
LAM RES CORP22 citations93
US7383843B2Jun 10, 2008
Method and apparatus for processing wafer surfaces using thin, high velocity fluid layer
LAM RES CORP28 citations92
US7799141B2Sep 21, 2010
Method and system for using a two-phases substrate cleaning compound
LAM RES CORP8 citations84
US7584761B1Sep 8, 2009
Wafer edge surface treatment with liquid meniscus
LAM RES CORP10 citations84
US7179154B1Feb 20, 2007
Method and apparatus for cleaning a wafer bevel edge and notch using a pin and an abrasive film cassette
LAM RES CORP12 citations82
US7387689B2Jun 17, 2008
Methods for drying semiconductor wafer surfaces using a plurality of inlets and outlets held in close proximity to the wafer surfaces
LAM RES CORP6 citations74
US9006893B2Apr 14, 2015
Devices for metallization
LAM RES CORP2 citations63
US7749893B2Jul 6, 2010
Methods and systems for low interfacial oxide contact between barrier and copper metallization
LAM RES CORP3 citations63
US7625452B2Dec 1, 2009
Apparatuses and methods for cleaning a substrate
LAM RES CORP2 citations62
US7592259B2Sep 22, 2009
Methods and systems for barrier layer surface passivation
LAM RES CORP4 citations62
US7441299B2Oct 28, 2008
Apparatuses and methods for cleaning a substrate
LAM RES CORP3 citations62
US7758404B1Jul 20, 2010
Apparatus for cleaning edge of substrate and method for using the same
LAM RES CORP6 citations59
US8970027B2Mar 3, 2015
Metallization mixtures and electronic devices
LAM RES CORP0 citations52
US8053355B2Nov 8, 2011
Methods and systems for low interfacial oxide contact between barrier and copper metallization
LAM RES CORP0 citations52
US8034409B2Oct 11, 2011
Methods, apparatuses, and systems for fabricating three dimensional integrated circuits
LAM RES CORP1 citations52
US7897213B2Mar 1, 2011
Methods for contained chemical surface treatment
LAM RES CORP0 citations52
US7568490B2Aug 4, 2009
Method and apparatus for cleaning semiconductor wafers using compressed and/or pressurized foams, bubbles, and/or liquids
LAM RES CORP0 citations52
US7534307B2May 19, 2009
Methods for processing wafer surfaces using thin, high velocity fluid layer
LAM RES CORP1 citations51
US7863179B2Jan 4, 2011
Methods of fabricating a barrier layer with varying composition for copper metallization
LAM RES CORP0 citations42
APPLIED MATERIALS INC
5 patentsUS5882424AMar 16, 1999
Plasma cleaning of a CVD or etch reactor using a low or mixed frequency excitation field
APPLIED MATERIALS INC325 citations99
US6299741B1Oct 9, 2001
Advanced electrolytic polish (AEP) assisted metal wafer planarization method and apparatus
APPLIED MATERIALS INC110 citations98
US6451697B1Sep 17, 2002
Method for abrasive-free metal CMP in passivation domain
APPLIED MATERIALS INC38 citations93
US6322427B1Nov 27, 2001
Conditioning fixed abrasive articles
APPLIED MATERIALS INC35 citations92
US7077725B2Jul 18, 2006
Advanced electrolytic polish (AEP) assisted metal wafer planarization method and apparatus
APPLIED MATERIALS INC3 citations63
BOYD JOHN
4 patentsUS8673769B2Mar 18, 2014
Methods and apparatuses for three dimensional integrated circuits
BOYD JOHN2 citations62
US8519461B2Aug 27, 2013
Device with post-contact back end of line through-hole via integration
BOYD JOHN4 citations62
US8187968B2May 29, 2012
Methods of post-contact back end of line through-hole via integration
BOYD JOHN2 citations62
US8323460B2Dec 4, 2012
Methods and systems for three-dimensional integrated circuit through hole via gapfill and overburden removal
BOYD JOHN0 citations41