Inventor
THIE WILLIAM
US33 patents
⚠️ This page may combine multiple inventors who share the name “THIE WILLIAM”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
LAM RES CORP
19 patentsUS7829152B2Nov 9, 2010
Electroless plating method and apparatus
LAM RES CORP18 citations92
US7297190B1Nov 20, 2007
Plating solutions for electroless deposition of copper
LAM RES CORP36 citations91
US8026605B2Sep 27, 2011
Interconnect structure and method of manufacturing a damascene structure
LAM RES CORP8 citations84
US7662253B2Feb 16, 2010
Apparatus for the removal of a metal oxide from a substrate and methods therefor
LAM RES CORP8 citations84
US7040332B2May 9, 2006
Method and apparatus for megasonic cleaning with reflected acoustic waves
LAM RES CORP12 citations84
US6995067B2Feb 7, 2006
Megasonic cleaning efficiency using auto-tuning of an RF generator at constant maximum efficiency
LAM RES CORP10 citations73
US7752996B2Jul 13, 2010
Apparatus for applying a plating solution for electroless deposition
LAM RES CORP4 citations63
US7875554B2Jan 25, 2011
Method for electroless depositing a material on a surface of a wafer
LAM RES CORP1 citations62
US7709400B2May 4, 2010
Thermal methods for cleaning post-CMP wafers
LAM RES CORP2 citations62
US7592259B2Sep 22, 2009
Methods and systems for barrier layer surface passivation
LAM RES CORP4 citations62
US8603913B1Dec 10, 2013
Porous dielectrics K value restoration by thermal treatment and or solvent treatment
LAM RES CORP3 citations61
US8790465B2Jul 29, 2014
Post-deposition cleaning methods for substrates with cap layers
LAM RES CORP1 citations52
US7909934B2Mar 22, 2011
Megasonic cleaning efficiency using auto-tuning of a RF generator at constant maximum efficiency
LAM RES CORP0 citations52
US9287110B2Mar 15, 2016
Method and apparatus for wafer electroless plating
LAM RES CORP0 citations51
US7884017B2Feb 8, 2011
Thermal methods for cleaning post-CMP wafers
LAM RES CORP0 citations51
US7582565B2Sep 1, 2009
Method and apparatus for semiconductor wafer planarization
LAM RES CORP0 citations51
US7368017B2May 6, 2008
Method and apparatus for semiconductor wafer planarization
LAM RES CORP0 citations51
US7358186B2Apr 15, 2008
Method and apparatus for material deposition in semiconductor fabrication
LAM RES CORP1 citations51
US9997364B2Jun 12, 2018
High aspect ratio etch
LAM RES CORP0 citations42
DORDI YEZDI
5 patentsUS8771804B2Jul 8, 2014
Processes and systems for engineering a copper surface for selective metal deposition
DORDI YEZDI16 citations83
US8241701B2Aug 14, 2012
Processes and systems for engineering a barrier surface for copper deposition
DORDI YEZDI16 citations83
US8747960B2Jun 10, 2014
Processes and systems for engineering a silicon-type surface for selective metal deposition to form a metal silicide
DORDI YEZDI11 citations81
US8490573B2Jul 23, 2013
Method and apparatus for material deposition
DORDI YEZDI1 citations61
US8133812B2Mar 13, 2012
Methods and systems for barrier layer surface passivation
DORDI YEZDI4 citations61
THIE WILLIAM
5 patentsUS8622020B2Jan 7, 2014
Simultaneous electroless plating of two substrates
THIE WILLIAM10 citations83
US8314027B2Nov 20, 2012
Wafer electroless plating system and associated methods
THIE WILLIAM2 citations60
US8485120B2Jul 16, 2013
Method and apparatus for wafer electroless plating
THIE WILLIAM1 citations50
US8069813B2Dec 6, 2011
Wafer electroless plating system and associated methods
THIE WILLIAM1 citations50
US8844461B2Sep 30, 2014
Fluid handling system for wafer electroless plating and associated methods
THIE WILLIAM0 citations39