Inventor
ARUNAGIRI TIRUCHIRAPALLI
US16 patents
⚠️ This page may combine multiple inventors who share the name “ARUNAGIRI TIRUCHIRAPALLI”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
LAM RES CORP
6 patentsUS8026605B2Sep 27, 2011
Interconnect structure and method of manufacturing a damascene structure
LAM RES CORP8 citations84
US7709400B2May 4, 2010
Thermal methods for cleaning post-CMP wafers
LAM RES CORP2 citations62
US7592259B2Sep 22, 2009
Methods and systems for barrier layer surface passivation
LAM RES CORP4 citations62
US8790465B2Jul 29, 2014
Post-deposition cleaning methods for substrates with cap layers
LAM RES CORP1 citations52
US9287110B2Mar 15, 2016
Method and apparatus for wafer electroless plating
LAM RES CORP0 citations51
US7884017B2Feb 8, 2011
Thermal methods for cleaning post-CMP wafers
LAM RES CORP0 citations51
DORDI YEZDI
4 patentsUS8771804B2Jul 8, 2014
Processes and systems for engineering a copper surface for selective metal deposition
DORDI YEZDI16 citations83
US8241701B2Aug 14, 2012
Processes and systems for engineering a barrier surface for copper deposition
DORDI YEZDI16 citations83
US8747960B2Jun 10, 2014
Processes and systems for engineering a silicon-type surface for selective metal deposition to form a metal silicide
DORDI YEZDI11 citations81
US8133812B2Mar 13, 2012
Methods and systems for barrier layer surface passivation
DORDI YEZDI4 citations61
THIE WILLIAM
4 patentsUS8314027B2Nov 20, 2012
Wafer electroless plating system and associated methods
THIE WILLIAM2 citations60
US8485120B2Jul 16, 2013
Method and apparatus for wafer electroless plating
THIE WILLIAM1 citations50
US8069813B2Dec 6, 2011
Wafer electroless plating system and associated methods
THIE WILLIAM1 citations50
US8844461B2Sep 30, 2014
Fluid handling system for wafer electroless plating and associated methods
THIE WILLIAM0 citations39