Inventor

JUNG YOONHA

KR8 patents

⚠️ This page may combine multiple inventors who share the name “JUNG YOONHA”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

SAMSUNG ELECTRONICS CO LTD

7 patents

US9425156B2Aug 23, 2016

Semiconductor packages having semiconductor chips disposed in opening in shielding core plate

SAMSUNG ELECTRONICS CO LTD11 citations82

US10825776B2Nov 3, 2020

Semiconductor packages having semiconductor chips disposed in opening in shielding core plate

SAMSUNG ELECTRONICS CO LTD3 citations71

US10211159B2Feb 19, 2019

Semiconductor packages having semiconductor chips disposed in opening in shielding core plate

SAMSUNG ELECTRONICS CO LTD2 citations71

US9659852B2May 23, 2017

Semiconductor package

SAMSUNG ELECTRONICS CO LTD4 citations70

US11824076B2Nov 21, 2023

Semiconductor package including an image sensor chip and a method of fabricating the same

SAMSUNG ELECTRONICS CO LTD0 citations61

US11335719B2May 17, 2022

Semiconductor package including an image sensor chip and a method of fabricating the same

SAMSUNG ELECTRONICS CO LTD1 citations61

US11842945B2Dec 12, 2023

Chip on film package and display apparatus including the same

SAMSUNG ELECTRONICS CO LTD0 citations59

KIM JONGKOOK

1 patent

US9252095B2Feb 2, 2016

Semiconductor package and method of fabricating the same

KIM JONGKOOK7 citations79