Inventor
HATAKEYAMA KEIICHI
JP14 patents
⚠️ This page may combine multiple inventors who share the name “HATAKEYAMA KEIICHI”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
HITACHI CHEMICAL CO LTD
4 patentsUS7517724B2Apr 14, 2009
Dicing/die bonding sheet
HITACHI CHEMICAL CO LTD22 citations91
US7070670B2Jul 4, 2006
Adhesive composition, method for preparing the same, adhesive film using the same, substrate for carrying semiconductor and semiconductor device
HITACHI CHEMICAL CO LTD46 citations91
US8034659B2Oct 11, 2011
Production method of semiconductor device and bonding film
HITACHI CHEMICAL CO LTD12 citations84
US7947779B2May 24, 2011
Semiconductor device by adhering circuit substrate with adhesive film of epoxy resin, phenolic resin and incompatible polymer
HITACHI CHEMICAL CO LTD3 citations61
HATAKEYAMA KEIICHI
2 patentsUS8198176B2Jun 12, 2012
Method for producing semiconductor chip with adhesive film, adhesive film for semiconductor used in the method, and method for producing semiconductor device
HATAKEYAMA KEIICHI27 citations90
US8071465B2Dec 6, 2011
Method for producing semiconductor chip with adhesive film, adhesive film for semiconductor used in the method, and method for producing semiconductor device
HATAKEYAMA KEIICHI4 citations60
RESONAC CORP
2 patentsNAKAMURA YUUKI
2 patentsUS8232185B2Jul 31, 2012
Method for manufacturing semiconductor chip, adhesive film for semiconductor, and composite sheet using the film
NAKAMURA YUUKI0 citations47
US8404564B2Mar 26, 2013
Adhesive film for semiconductor, composite sheet, and method for producing semiconductor chip using them
NAKAMURA YUUKI0 citations36