Inventor · disambiguated record
Michihiko Ichinose
Also filed as: ICHINOSE MICHIHIKO
10 granted patents·324 citations·filing 1998–2001
91Inventor score
Technology areasH10W
Top patents by PatentIndex Score
10 records- 0191US6747361B2Semiconductor device and packaging method thereofNEC ELECTRONICS CORP·Filed 2001·Granted Jun 8, 2004·80 cites·4 claims
- 0289US6611063B1Resin-encapsulated semiconductor deviceNEC ELECTRONICS CORP·Filed 2000·Granted Aug 26, 2003·89 cites·1 claims
- 0382US6504244B2Semiconductor device and semiconductor module using the sameNEC CORP·Filed 2001·Granted Jan 7, 2003·41 cites·42 claims
- 0478US6166443ASemiconductor device with reduced thicknessNEC CORP·Filed 1999·Granted Dec 26, 2000·58 cites·12 claims
- 0563US6538305B2BGA type semiconductor device having a solder-flow damping/stopping patternNEC CORP·Filed 2001·Granted Mar 25, 2003·12 cites·7 claims
- 0656US6265760B1Semiconductor device, and semiconductor device with die pad and protruding chip lead frame and method of manufacturing the sameNEC CORP·Filed 1999·Granted Jul 24, 2001·22 cites·10 claims
- 0745US6246117B1Semiconductor device comprised of a ball grid array and an insulating film with preformed land openingsNEC CORP·Filed 1999·Granted Jun 12, 2001·13 cites·5 claims
- 0834US6211573B1Semiconductor device with an improved lead-chip adhesion structure and lead frame to be used thereforNEC CORP·Filed 1998·Granted Apr 3, 2001·5 cites·39 claims
- 0930US6215169B1Semiconductor device with adhesive tape not overlapping an opening in the uppermost surface of the semiconductor element surfaceNEC CORP·Filed 1999·Granted Apr 10, 2001·1 cites·7 claims
- 1028US6259152B1Hybrid leadframe having conductive leads less deformable and semiconductor device using the sameNEC CORP·Filed 1999·Granted Jul 10, 2001·3 cites·16 claims
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