Inventor
CHEN TAO-YU
TW5 patents
Patents
5 patentsUS6338813B1Jan 15, 2002
Molding method for BGA semiconductor chip package
ADVANCED SEMICONDUCTOR ENG85 citations97
US6316828B1Nov 13, 2001
Structure of a solder mask for the circuit module of a BGA substrate
ADVANCED SEMICONDUCTOR ENG27 citations92
US6176417B1Jan 23, 2001
Ball bonding method on a chip
ADVANCED SEMICONDUCTOR ENG14 citations73
US5982625ANov 9, 1999
Semiconductor packaging device
ADVANCED SEMICONDUCTOR ENG15 citations71
US7168352B2Jan 30, 2007
Process for sawing substrate strip
ADVANCED SEMICONDUCTOR ENG3 citations59