P

Inventor

MALLADI DEVIPRASAD

US20 patents
⚠️ This page may combine multiple inventors who share the name “MALLADI DEVIPRASAD”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

SUN MICROSYSTEMS INC

18 patents
US5831333ANov 3, 1998

Integrated junction temperature sensor/package design and method of implementing same

SUN MICROSYSTEMS INC61 citations95
US5629240AMay 13, 1997

Method for direct attachment of an on-chip bypass capacitor in an integrated circuit

SUN MICROSYSTEMS INC98 citations95
US5972736AOct 26, 1999

Integrated circuit package and method

SUN MICROSYSTEMS INC81 citations94
US5528083AJun 18, 1996

Thin film chip capacitor for electrical noise reduction in integrated circuits

SUN MICROSYSTEMS INC118 citations93
US6436737B1Aug 20, 2002

Method for reducing soft error rates in semiconductor devices

SUN MICROSYSTEMS INC20 citations92
US5598035AJan 28, 1997

Integrated circuit package with external storage capacitor for improved signal quality for sensitive integrated circuit elements

SUN MICROSYSTEMS INC22 citations92
US5367193ANov 22, 1994

Low cost, thermally efficient, and surface mountable semiconductor package for a high applied power VLSI die

SUN MICROSYSTEMS INC50 citations92
US5780930AJul 14, 1998

Method for direct attachment of an on-chip bypass capacitor in an integrated circuit

SUN MICROSYSTEMS INC37 citations90
US6472900B1Oct 29, 2002

Efficient device debug system

SUN MICROSYSTEMS INC16 citations89
US6246252B1Jun 12, 2001

Efficient debug package design

SUN MICROSYSTEMS INC21 citations89
US5701085ADec 23, 1997

Apparatus for testing flip chip or wire bond integrated circuits

SUN MICROSYSTEMS INC72 citations89
US6944025B2Sep 13, 2005

EMI shielding apparatus

SUN MICROSYSTEMS INC26 citations88
US5734554AMar 31, 1998

Heat sink and fan for cooling CPU chip

SUN MICROSYSTEMS INC21 citations88
US7301227B1Nov 27, 2007

Package lid or heat spreader for microprocessor packages

SUN MICROSYSTEMS INC18 citations84
US6637506B2Oct 28, 2003

Multi-material heat spreader

SUN MICROSYSTEMS INC16 citations84
US6351389B1Feb 26, 2002

Device and method for packaging an electronic device

SUN MICROSYSTEMS INC15 citations84
US6636825B1Oct 21, 2003

Component level, CPU-testable, multi-chip package using grid arrays

SUN MICROSYSTEMS INC19 citations79
US6727193B2Apr 27, 2004

Apparatus and methods for enhancing thermal performance of integrated circuit packages

SUN MICROSYSTEMS INC2 citations62

ORACLE AMERICA INC

1 patent

GEKTIN VADIM

1 patent