Inventor

PARK DAE KEUN

KR26 patents

⚠️ This page may combine multiple inventors who share the name “PARK DAE KEUN”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

PARK DAE KEUN

AMKOR TECHNOLOGY INC

Exposed die overmolded flip chip package and fabrication method

Exposed die overmolded flip chip package and fabrication method

Exposed die overmolded flip chip package and fabrication method

Exposed die overmolded flip chip package and fabrication method

Exposed die overmolded flip chip package

SAMSUNG ELECTRONICS CO LTD

Methods of fabricating semiconductor device having slope at lower sides of interconnection hole with etch-stop layer

Electronic device and display control method thereof

Methods of fabricating semiconductor device having slope at lower sides of interconnection hole with etch-stop layer

Method and electronic device for generating new luminance level between two adjacent luminance levels

Method of fabricating a semiconductor device

HANON SYSTEMS

Air conditioner for vehicle

Air conditioner for vehicle

Heat exchanger

Blower unit for vehicle, and air conditioning device comprising same

Heat exchanger

HALLA VISTEON CLIMATE CONTROL

Double pipe type heat exchanger and method for manufacturing the same

Silencer for a vehicle air conditioning system

Silencer for a vehicle air conditioning system

CHEAH CHUAN

High voltage cascoded III-nitride rectifier package with stamped leadframe

High voltage cascoded III-nitride rectifier package utilizing clips on package surface

High voltage cascoded III-nitride rectifier package with etched leadframe

INT RECTIFIER CORP

High voltage cascoded III-nitride rectifier package

III-nitride rectifier package

BYON SANG CHUL

Double pipe type heat exchanger and method for manufacturing the same

DARVEAUX ROBERT FRANCIS

Exposed die overmolded flip chip package method

HYUNDAI MOTOR CO LTD

Air conditioner housing for a vehicle