Inventor
DUNLOP JAMES BERNARD
US4 patents
Patents
4 patentsUS9950154B2Apr 24, 2018
Method of manufacturing an implantable electrode array by forming packages around the array control modules after the control modules are bonded to substrates
STRYKER CORP1 citations58
US9770582B2Sep 26, 2017
Implantable electrode array assembly including a carrier with embedded control modules contained in packages, the packages extending outwardly so as to extend over the carrier
STRYKER CORP1 citations58
US10525258B2Jan 7, 2020
Implantable electrode array assembly including a carrier with packaged control modules
STRYKER CORP0 citations49
US10342971B2Jul 9, 2019
Implantable electrode array assembly with an array substrate, electrodes and packaged integrated circuits
STRYKER CORP0 citations49