Inventor · disambiguated record
Jeroen Johannes Maria Zaal
Also filed as: ZAAL JEROEN JOHANNES MARIA
8 granted patents·2 pending applications·6 citations·filing 2012–2024
76Inventor score
Top patents by PatentIndex Score
10 records- 0170US10825789B1Underbump metallization dimension variation with improved reliabilityNXP BV·Filed 2019·Granted Nov 3, 2020·2 cites·21 claims
- 0267US10315821B2Component carrierNXP BV·Filed 2016·Granted Jun 11, 2019·1 cites·18 claims
- 0365US9182110B2Lighting device with a circuit board mountingKADIJK SIMON EME·Filed 2012·Granted Nov 10, 2015·2 cites·14 claims
- 0459US2025006596A1Qfn packaged semiconductor device and method of making thereofNXP USA INC·Filed 2024·Application pending·0 cites
- 0557US10593635B2Multi-die and antenna array deviceNXP BV·Filed 2018·Granted Mar 17, 2020·1 cites·19 claims
- 0656US12119316B2Patterned and planarized under-bump metallizationNXP USA INC·Filed 2022·Granted Oct 15, 2024·0 cites·18 claims
- 0749US2024014152A1Semiconductor device with under-bump metallization and method thereforNXP BV·Filed 2022·Application pending·0 cites
- 0843US11508669B2Method and apparatus for improved circuit structure thermal reliability on printed circuit board materialsNXP BV·Filed 2019·Granted Nov 22, 2022·0 cites·17 claims
- 0937US9799629B2Integrated circuit dies with through-die viasNXP BV·Filed 2016·Granted Oct 24, 2017·0 cites·12 claims
- 1035US10431575B2Multi-die array deviceNXP BV·Filed 2017·Granted Oct 1, 2019·0 cites·19 claims
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