Inventor · disambiguated record
Roelf Anco Jacob Groenhuis
Also filed as: GROENHUIS ROELF · GROENHUIS ROELF A J · GROENHUIS ROELF ANCO JACOB
22 granted patents·7 pending applications·201 citations·filing 1996–2021
95Inventor score
Top patents by PatentIndex Score
29 records- 0193US9466585B1Reducing defects in wafer level chip scale package (WLCSP) devicesNXP BV·Filed 2015·Granted Oct 11, 2016·17 cites·12 claims
- 0292US10177111B2Reduction of defects in wafer level chip scale package (WLCSP) devicesNXP BV·Filed 2017·Granted Jan 8, 2019·10 cites·12 claims
- 0392US8183682B2Methods of packaging a semiconductor die and package formed by the methodsDIJKSTRA PAUL·Filed 2006·Granted May 22, 2012·36 cites·25 claims
- 0490US9704823B2Reduction of defects in wafer level chip scale package (WLCSP) devicesNXP BV·Filed 2015·Granted Jul 11, 2017·8 cites·4 claims
- 0586US9222989B2Manufacturing methods for a sensor package including a lead frameNXP BV·Filed 2014·Granted Dec 29, 2015·9 cites·8 claims
- 0684US9418918B2Lead for connection to a semiconductor deviceNXP BV·Filed 2015·Granted Aug 16, 2016·5 cites·17 claims
- 0783US7247938B2Carrier, method of manufacturing a carrier and an electronic deviceNXP BV·Filed 2003·Granted Jul 24, 2007·35 cites·10 claims
- 0879US9418919B2Leadless chip carrier having improved mountabilityGROENHUIS ROELF ANCO JACOB·Filed 2011·Granted Aug 16, 2016·8 cites·15 claims
- 0976US7944062B2Air cavity package for a semiconductor die and methods of forming the air cavity packageNXP BV·Filed 2006·Granted May 17, 2011·7 cites·25 claims
- 1072US10109564B2Wafer level chip scale semiconductor packageNXP BV·Filed 2017·Granted Oct 23, 2018·2 cites·20 claims
- 1168US8159826B2Surface treatments for contact pads used in semiconductor chip packagages and methods of providing such surface treatmentsDIJKSTRA PAUL·Filed 2006·Granted Apr 17, 2012·6 cites·16 claims
- 1268US5703401AMiniature semiconductor device for surface mountingPHILIPS CORP·Filed 1996·Granted Dec 30, 1997·45 cites·5 claims
- 1367US10315821B2Component carrierNXP BV·Filed 2016·Granted Jun 11, 2019·1 cites·18 claims
- 1467US9842776B2Integrated circuits and molding approaches thereforNXP BV·Filed 2016·Granted Dec 12, 2017·2 cites·18 claims
- 1562US8664946B2Sensor packages including a lead frame and moulding body and methods of manufacturingHESEN PAULUS MARTINUS CATHARINA·Filed 2008·Granted Mar 4, 2014·4 cites·6 claims
- 1651US7858444B2Electronic device and method of manufacturing thereofNXP BV·Filed 2009·Granted Dec 28, 2010·0 cites·10 claims
- 1749US8981566B2Discrete semiconductor device package and manufacturing methodNXP BV·Filed 2013·Granted Mar 17, 2015·0 cites·9 claims
- 1849US7022588B2Method of manufacturing an electronic component and electronic component obtained by means of said methodKONINKL PHILIPS ELECTRONICS NV·Filed 2002·Granted Apr 4, 2006·3 cites·14 claims
- 1948US8884410B2Method for manufacturing a microelectronic package comprising at least one microelectronic deviceVAN DE WATER PETER WILHELMUS MARIA·Filed 2009·Granted Nov 11, 2014·1 cites·2 claims
- 2046US9263335B2Discrete semiconductor device package and manufacturing methodNXP BV·Filed 2015·Granted Feb 16, 2016·0 cites·7 claims
- 2146US7514801B2Electronic device and method of manufacturing thereofNXP BV·Filed 2004·Granted Apr 7, 2009·2 cites·12 claims
- 2241US2022020679A1Semiconductor device and a method of manufactureNexperia BV·Filed 2021·Application pending·0 cites
- 2341US2022020670A1Semiconductor device and a method of manufactureNexperia BV·Filed 2021·Application pending·0 cites
- 2439US2016005679A1Exposed die quad flat no-leads (qfn) packageNXP BV·Filed 2014·Application pending·0 cites
- 2536US2013334695A1Electronic device and method of manufacturing such deviceNXP BV·Filed 2013·Application pending·0 cites
- 2635US2012286399A1Leadframe and method for packaging semiconductor dieBOETTCHER TIM·Filed 2012·Application pending·0 cites
- 2732US2012112351A1Semiconductor device packaging method and semiconductor device packageWALCZYK SVEN·Filed 2011·Application pending·0 cites
- 2831US8508035B2Circuit connector apparatus and method thereforGROENHUIS ROELF ANCO JACOB·Filed 2011·Granted Aug 13, 2013·0 cites·15 claims
- 2930US2012286410A1Semiconductor device packaging method and semiconductor device packageGROENHUIS ROELF ANCO JACOB·Filed 2011·Application pending·0 cites
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