Inventor
WATANABE RIHOKO
JP5 patents
Patents
5 patentsUS12122129B2Oct 22, 2024
Resin composition, and prepreg, resin-coated film, resin-coated metal foil, metal-clad laminate, and wiring board each obtained using said resin composition
PANASONIC IP MAN CO LTD0 citations59
US11945910B2Apr 2, 2024
Resin composition, and prepreg, resin-coated film, resin-coated metal foil, metal-clad laminate, and wiring board each obtained using said resin composition
PANASONIC IP MAN CO LTD0 citations59
US11234329B2Jan 25, 2022
Prepreg, substrate, metal-clad laminate, semiconductor package, and printed circuit board
PANASONIC IP MAN CO LTD0 citations59
US11407869B2Aug 9, 2022
Prepreg, metal-clad laminate and printed wiring board
PANASONIC IP MAN CO LTD0 citations48
US12275846B2Apr 15, 2025
Resin composition, prepreg, film with resin, metal foil with resin, metal-clad laminate, and printed wiring board
PANASONIC IP MAN CO LTD0 citations42