Inventor
CHIU HOPE
CN11 patents
⚠️ This page may combine multiple inventors who share the name “CHIU HOPE”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
WESTERN DIGITAL TECH INC
10 patentsUS11837476B2Dec 5, 2023
Flip-chip package with reduced underfill area
WESTERN DIGITAL TECH INC3 citations68
US11942459B2Mar 26, 2024
Semiconductor device package with exposed bond wires
WESTERN DIGITAL TECH INC2 citations67
US11810896B2Nov 7, 2023
Substrate component layout and bonding method for increased package capacity
WESTERN DIGITAL TECH INC0 citations58
US11508644B2Nov 22, 2022
Semiconductor device package having thermally conductive pathways
WESTERN DIGITAL TECH INC1 citations57
US12062625B2Aug 13, 2024
Semiconductor device package mold flow control system and method
WESTERN DIGITAL TECH INC0 citations55
US11488883B1Nov 1, 2022
Semiconductor device package having thermally conductive layers for heat dissipation
WESTERN DIGITAL TECH INC0 citations54
US12347810B2Jul 1, 2025
Semiconductor device package die stacking system and method
WESTERN DIGITAL TECH INC0 citations49
US12027497B2Jul 2, 2024
Semiconductor device with unbalanced die stackup
WESTERN DIGITAL TECH INC0 citations46
US12021060B2Jun 25, 2024
Reducing keep-out-zone area for a semiconductor device
WESTERN DIGITAL TECH INC0 citations46
US12021061B2Jun 25, 2024
Packaged memory device with flip chip and wire bond dies
WESTERN DIGITAL TECH INC0 citations46