Inventor
FLAITZ PHILIP L
US14 patents
⚠️ This page may combine multiple inventors who share the name “FLAITZ PHILIP L”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
IBM
12 patentsUS5130067AJul 14, 1992
Method and means for co-sintering ceramic/metal mlc substrates
IBM140 citations96
US7402532B2Jul 22, 2008
Structure to improve adhesion between top CVD low-k dielectric and dielectric capping layer
IBM28 citations92
US7102232B2Sep 5, 2006
Structure to improve adhesion between top CVD low-k dielectric and dielectric capping layer
IBM19 citations92
US6746933B1Jun 8, 2004
Pitcher-shaped active area for field effect transistor and method of forming same
IBM35 citations92
US4764341AAug 16, 1988
Bonding of pure metal films to ceramics
IBM22 citations81
US6960514B2Nov 1, 2005
Pitcher-shaped active area for field effect transistor and method of forming same
IBM9 citations73
US7820559B2Oct 26, 2010
Structure to improve adhesion between top CVD low-K dielectric and dielectric capping layer
IBM4 citations72
US4755631AJul 5, 1988
Apparatus for providing an electrical connection to a metallic pad situated on a brittle dielectric substrate
IBM19 citations71
US4672739AJun 16, 1987
Method for use in brazing an interconnect pin to a metallization pattern situated on a brittle dielectric substrate
IBM13 citations71
US7951708B2May 31, 2011
Copper interconnect structure with amorphous tantalum iridium diffusion barrier
IBM5 citations63
US5167913ADec 1, 1992
Method of forming an adherent layer of metallurgy on a ceramic substrate
IBM6 citations62
US6333531B1Dec 25, 2001
Dopant control of semiconductor devices
IBM2 citations59