Inventor
LIN CHUEN-JYE
TW16 patents
⚠️ This page may combine multiple inventors who share the name “LIN CHUEN-JYE”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
MEGICA CORP
4 patentsUS7902679B2Mar 8, 2011
Structure and manufacturing method of a chip scale package with low fabrication cost, fine pitch and high reliability solder bump
MEGICA CORP111 citations98
US7465653B2Dec 16, 2008
Reliable metal bumps on top of I/O pads after removal of test probe marks
MEGICA CORP22 citations92
US7355288B2Apr 8, 2008
Low fabrication cost, high performance, high reliability chip scale package
MEGICA CORP20 citations92
US7338890B2Mar 4, 2008
Low fabrication cost, high performance, high reliability chip scale package
MEGICA CORP23 citations92
MEGIC CORP
3 patentsUS6917119B2Jul 12, 2005
Low fabrication cost, high performance, high reliability chip scale package
MEGIC CORP106 citations99
US6642136B1Nov 4, 2003
Method of making a low fabrication cost, high performance, high reliability chip scale package
MEGIC CORP123 citations99
US6815324B2Nov 9, 2004
Reliable metal bumps on top of I/O pads after removal of test probe marks
MEGIC CORP70 citations96
LEE JIN-YUAN
3 patentsUS9369175B2Jun 14, 2016
Low fabrication cost, high performance, high reliability chip scale package
LEE JIN-YUAN9 citations84
US8481418B2Jul 9, 2013
Low fabrication cost, high performance, high reliability chip scale package
LEE JIN-YUAN6 citations84
US8178967B2May 15, 2012
Low fabrication cost, high performance, high reliability chip scale package
LEE JIN-YUAN3 citations63