Inventor

SHIMOKAWA KENJI

JP19 patents

⚠️ This page may combine multiple inventors who share the name “SHIMOKAWA KENJI”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

SHIMOKAWA KENJI

NIPPON STEEL CORP

Production of small metal bumps

Method for fabricating a semiconductor devices provided with low melting point metal bumps

Semiconductor device provided with low melting point metal bumps

Ball transferring method and apparatus

Ball-arranging substrate for forming bump, ball-arranging head, ball-arranging device, and ball-arranging method

Spherical semiconductor device and method for fabricating the same

Magneto-optical recording medium, disk and method of manufacturing the same

Transfer of flux onto electrodes and production of bumps on electrodes

Garnet polycrystalline film for magneto-optical recording medium

Method of partially plating substrate for electronic devices

CHIYODA CHEM ENG CONSTRUCT CO

Process for hydrocracking heavy hydrocarbon oils and catalyst therefor

Supported rhodium catalyst, method of preparing same and process of producing acetic acid by methanol carbonylation using same

Process for the production of 2,6-diisopropylnaphthalene

Process for preparing organic carboxylic acid

Method of separating 2,6-diisopropylnaphthalene from a mixture containing diisopropylnaphthalene isomers

AGENCY IND SCIENCE TECHN

Solar energy collecting system

Cooling system using low potential and high potential energies

BALL SEMICONDUCTOR CORP

Spherical semiconductor device and method for fabricating the same

NIPPON STEEL MATERIALS CO LTD

Ball transferring method and apparatus