Inventor
HASHINO EIJI
JP13 patents
⚠️ This page may combine multiple inventors who share the name “HASHINO EIJI”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
NIPPON STEEL CORP
9 patentsUS7465217B2Dec 16, 2008
CMP conditioner, method for arranging hard abrasive grains for use in CMP conditioner, and process for producing CMP conditioner
NIPPON STEEL CORP36 citations91
US5765744AJun 16, 1998
Production of small metal bumps
NIPPON STEEL CORP29 citations89
US7045388B2May 16, 2006
Semiconductor device provided with low melting point metal bumps
NIPPON STEEL CORP6 citations73
US7045389B1May 16, 2006
Method for fabricating a semiconductor devices provided with low melting point metal bumps
NIPPON STEEL CORP9 citations73
US6916731B2Jul 12, 2005
Ball transferring method and apparatus
NIPPON STEEL CORP8 citations73
US6571007B1May 27, 2003
Ball-arranging substrate for forming bump, ball-arranging head, ball-arranging device, and ball-arranging method
NIPPON STEEL CORP11 citations73
US6509645B2Jan 21, 2003
Spherical semiconductor device and method for fabricating the same
NIPPON STEEL CORP10 citations73
US5899376AMay 4, 1999
Transfer of flux onto electrodes and production of bumps on electrodes
NIPPON STEEL CORP8 citations71
US6884708B2Apr 26, 2005
Method of partially plating substrate for electronic devices
NIPPON STEEL CORP0 citations51