Inventor

LIAO CHIN-HSIUNG

TW3 patents

Patents

3 patents

US7675396B2Mar 9, 2010

Inductor and manufacture method thereof

CYNTEC CO LTD20 citations91

US6975513B2Dec 13, 2005

Construction for high density power module package

CYNTEC CO LTD9 citations71

US6775145B1Aug 10, 2004

Construction for high density power module package (case II)

CYNTEC CO LTD11 citations71