Inventor
YOW KAI YUN
MY14 patents
⚠️ This page may combine multiple inventors who share the name “YOW KAI YUN”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
YOW KAI YUN
7 patentsUS8501517B1Aug 6, 2013
Method of assembling pressure sensor device
YOW KAI YUN21 citations90
US9165855B1Oct 20, 2015
Semiconductor device with die attached heat spreader
YOW KAI YUN5 citations71
US8643169B2Feb 4, 2014
Semiconductor sensor device with over-molded lid
YOW KAI YUN3 citations60
US8078353B2Dec 13, 2011
Self monitoring braking system for vehicles
YOW KAI YUN3 citations60
US8836091B1Sep 16, 2014
Lead frame for semiconductor package with enhanced stress relief
YOW KAI YUN3 citations59
US9437492B2Sep 6, 2016
Substrate for alternative semiconductor die configurations
YOW KAI YUN1 citations51
US9196576B2Nov 24, 2015
Semiconductor package with stress relief and heat spreader
YOW KAI YUN1 citations49
FREESCALE SEMICONDUCTOR INC
4 patentsUS7868449B2Jan 11, 2011
Semiconductor substrate and method of connecting semiconductor die to substrate
FREESCALE SEMICONDUCTOR INC2 citations61
US7759753B2Jul 20, 2010
Integrated circuit die, integrated circuit package, and packaging method
FREESCALE SEMICONDUCTOR INC1 citations50
US9646853B1May 9, 2017
IC device having patterned, non-conductive substrate
FREESCALE SEMICONDUCTOR INC0 citations40
US9698093B2Jul 4, 2017
Universal BGA substrate
FREESCALE SEMICONDUCTOR INC0 citations38