Inventor
CHENG YANG-CHUN
TW12 patents
⚠️ This page may combine multiple inventors who share the name “CHENG YANG-CHUN”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
TAIWAN SEMICONDUCTOR MFG CO LTD
10 patentsUS11482450B2Oct 25, 2022
Methods of forming an abrasive slurry and methods for chemical- mechanical polishing
TAIWAN SEMICONDUCTOR MFG CO LTD1 citations72
US10937691B2Mar 2, 2021
Methods of forming an abrasive slurry and methods for chemical-mechanical polishing
TAIWAN SEMICONDUCTOR MFG CO LTD1 citations72
US12224179B2Feb 11, 2025
Metal heterojunction structure with capping metal layer
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US11637021B2Apr 25, 2023
Metal heterojunction structure with capping metal layer
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US11633829B2Apr 25, 2023
External heating system for use in chemical mechanical polishing system
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US11094555B2Aug 17, 2021
CMP slurry and CMP method
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US11037799B2Jun 15, 2021
Metal heterojunction structure with capping metal layer
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US12550695B2Feb 10, 2026
Methods of forming an abrasive slurry and methods for chemical-mechanical polishing
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations61
US11133247B2Sep 28, 2021
Vias with metal caps for underlying conductive lines
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations51
US10692732B2Jun 23, 2020
CMP slurry and CMP method
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations51