Inventor
CHANDRASEKARAN ARVIND
US22 patents
⚠️ This page may combine multiple inventors who share the name “CHANDRASEKARAN ARVIND”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
CHANDRASEKARAN ARVIND
13 patentsUS8525342B2Sep 3, 2013
Dual-side interconnected CMOS for stacked integrated circuits
CHANDRASEKARAN ARVIND248 citations98
US8557680B2Oct 15, 2013
Semiconductor wafer-to-wafer bonding for dissimilar semiconductor dies and/or wafers
CHANDRASEKARAN ARVIND7 citations83
US8310061B2Nov 13, 2012
Stacked die parallel plate capacitor
CHANDRASEKARAN ARVIND10 citations83
US8242543B2Aug 14, 2012
Semiconductor wafer-to-wafer bonding for dissimilar semiconductor dies and/or wafers
CHANDRASEKARAN ARVIND12 citations83
US8076762B2Dec 13, 2011
Variable feature interface that induces a balanced stress to prevent thin die warpage
CHANDRASEKARAN ARVIND8 citations83
US8451581B2May 28, 2013
Passive coupler between package substrate and system board
CHANDRASEKARAN ARVIND6 citations73
US9252128B2Feb 2, 2016
Panelized backside processing for thin semiconductors
CHANDRASEKARAN ARVIND3 citations72
US8445994B2May 21, 2013
Discontinuous thin semiconductor wafer surface features
CHANDRASEKARAN ARVIND3 citations62
US8391018B2Mar 5, 2013
Semiconductor die-based packaging interconnect
CHANDRASEKARAN ARVIND4 citations62
US8294280B2Oct 23, 2012
Panelized backside processing for thin semiconductors
CHANDRASEKARAN ARVIND4 citations62
US8283776B2Oct 9, 2012
Microfabricated pillar fins for thermal management
CHANDRASEKARAN ARVIND4 citations62
US8877563B2Nov 4, 2014
Microfabricated pillar fins for thermal management
CHANDRASEKARAN ARVIND0 citations51
US8482125B2Jul 9, 2013
Conductive sidewall for microbumps
CHANDRASEKARAN ARVIND0 citations50
QUALCOMM INC
5 patentsUS7969009B2Jun 28, 2011
Through silicon via bridge interconnect
QUALCOMM INC175 citations98
US8354300B2Jan 15, 2013
Reducing susceptibility to electrostatic discharge damage during die-to-die bonding for 3-D packaged integrated circuits
QUALCOMM INC13 citations83
US8513089B2Aug 20, 2013
Discontinuous thin semiconductor wafer surface features
QUALCOMM INC2 citations62
US7900519B2Mar 8, 2011
Microfluidic measuring tool to measure through-silicon via depth
QUALCOMM INC4 citations62
US8912043B2Dec 16, 2014
Dual-side interconnected CMOS for stacked integrated circuits
QUALCOMM INC1 citations51