Inventor
CARDEN TIMOTHY F
US7 patents
Patents
7 patentsUS6552266B2Apr 22, 2003
High performance chip packaging and method
IBM96 citations95
US6224711B1May 1, 2001
Assembly process for flip chip package having a low stress chip and resulting structure
IBM56 citations94
US6488806B2Dec 3, 2002
Assembly process for flip chip package having a low stress chip and resulting structure
IBM20 citations91
US6538213B1Mar 25, 2003
High density design for organic chip carriers
IBM40 citations90
US4803100AFeb 7, 1989
Suspension and use thereof
IBM13 citations72
US6552264B2Apr 22, 2003
High performance chip packaging and method
IBM9 citations71
US6655020B2Dec 2, 2003
Method of packaging a high performance chip
IBM0 citations49