Inventor
ENGLE STEPHEN R
US6 patents
Patents
6 patentsUS6552266B2Apr 22, 2003
High performance chip packaging and method
IBM96 citations95
US5572405ANov 5, 1996
Thermally enhanced ball grid array package
IBM98 citations94
US5243133ASep 7, 1993
Ceramic chip carrier with lead frame or edge clip
IBM61 citations94
US4803100AFeb 7, 1989
Suspension and use thereof
IBM13 citations72
US6552264B2Apr 22, 2003
High performance chip packaging and method
IBM9 citations71
US6655020B2Dec 2, 2003
Method of packaging a high performance chip
IBM0 citations49