Inventor
KATO HAZIME
JP7 patents
Patents
7 patentsUS5610799AMar 11, 1997
Power module device
MITSUBISHI ELECTRIC CORP70 citations94
US5536972AJul 16, 1996
Power module
MITSUBISHI ELECTRIC CORP55 citations94
US5459350AOct 17, 1995
Resin sealed type semiconductor device
MITSUBISHI ELECTRIC CORP32 citations88
US5434449AJul 18, 1995
Semiconductor device in a single package with high wiring density and a heat sink
MITSUBISHI ELECTRIC CORP24 citations85
US5563441AOct 8, 1996
Lead frame assembly including a semiconductor device and a resistance wire
MITSUBISHI ELECTRIC CORP17 citations72
US5460319AOct 24, 1995
Lead, method of assembling an integrated circuit device, integrated circuit device, lead for providing a conductive path and method of providing a conductive path
MITSUBISHI ELECTRIC CORP8 citations72
US5260602ANov 9, 1993
Hybrid integrated-circuit device having an asymmetrical thermal dissipator
MITSUBISHI ELECTRIC CORP2 citations52