P

Inventor

FUNADA YASUHITO

JP21 patents
⚠️ This page may combine multiple inventors who share the name “FUNADA YASUHITO”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

NITTO DENKO CORP

19 patents
US6100582AAug 8, 2000

Circuit substrate, circuit-formed suspension substrate, and production method thereof

NITTO DENKO CORP56 citations96
US6096482AAug 1, 2000

Circuit substrate, circuit-formed suspension substrate, and production method thereof

NITTO DENKO CORP54 citations96
US5858518AJan 12, 1999

Circuit substrate, circuit-formed suspension substrate, and production method thereof

NITTO DENKO CORP52 citations96
US7182606B2Feb 27, 2007

Wired circuit board

NITTO DENKO CORP25 citations92
US5578249ANov 26, 1996

Process for producing electrically conductive organic polymer composition

NITTO DENKO CORP46 citations92
US7336446B2Feb 26, 2008

Suspension board having a circuit and a flying lead portion

NITTO DENKO CORP21 citations91
US7307853B2Dec 11, 2007

Wired circuit board assembly

NITTO DENKO CORP11 citations84
US6245432B1Jun 12, 2001

Circuit substrate, circuit-formed suspension substrate, and production methods therefor

NITTO DENKO CORP7 citations73
US6117616ASep 12, 2000

Circuit-forming substrate and circuit substrate

NITTO DENKO CORP7 citations73
US7638873B2Dec 29, 2009

Wired circuit board

NITTO DENKO CORP3 citations63
US7566833B2Jul 28, 2009

Wired circuit board and production method thereof

NITTO DENKO CORP2 citations63
US7531753B2May 12, 2009

Suspension board with circuit

NITTO DENKO CORP2 citations63
US7525764B2Apr 28, 2009

Suspension board with circuit

NITTO DENKO CORP5 citations62
US7471519B2Dec 30, 2008

Wired circuit board

NITTO DENKO CORP2 citations62
US7084493B2Aug 1, 2006

Wiring circuit board and production method thereof

NITTO DENKO CORP5 citations62
US6333139B1Dec 25, 2001

Circuit-forming substrate and circuit substrate

NITTO DENKO CORP4 citations62
US7586046B2Sep 8, 2009

Wired circuit board

NITTO DENKO CORP0 citations52
US7501581B2Mar 10, 2009

Wired circuit board and producing method thereof

NITTO DENKO CORP0 citations52
US7008752B2Mar 7, 2006

Photosensitive resin composition and use of the same

NITTO DENKO CORP0 citations52

ISHII JUN

2 patents