Inventor
NOMOTO RYUJI
JP20 patents
⚠️ This page may combine multiple inventors who share the name “NOMOTO RYUJI”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
FUJITSU LTD
18 patentsUS6376921B1Apr 23, 2002
Semiconductor device, method for fabricating the semiconductor device, lead frame and method for producing the lead frame
FUJITSU LTD120 citations99
US6255740B1Jul 3, 2001
Semiconductor device having a lead portion with outer connecting terminals
FUJITSU LTD122 citations99
US6072239AJun 6, 2000
Device having resin package with projections
FUJITSU LTD241 citations99
US5656550AAug 12, 1997
Method of producing a semicondutor device having a lead portion with outer connecting terminal
FUJITSU LTD366 citations99
US7122897B2Oct 17, 2006
Semiconductor device and method of manufacturing the semiconductor device
FUJITSU LTD72 citations98
US6573121B2Jun 3, 2003
Semiconductor device, method for fabricating the semiconductor device, lead frame and method for producing the lead frame
FUJITSU LTD126 citations98
US6476503B1Nov 5, 2002
Semiconductor device having columnar electrode and method of manufacturing same
FUJITSU LTD266 citations98
US7456089B2Nov 25, 2008
Semiconductor device and method of manufacturing the semiconductor device
FUJITSU LTD53 citations96
US6329711B1Dec 11, 2001
Semiconductor device and mounting structure
FUJITSU LTD122 citations96
US6288444B1Sep 11, 2001
Semiconductor device and method of producing the same
FUJITSU LTD80 citations96
US6215182B1Apr 10, 2001
Semiconductor device and method for producing the same
FUJITSU LTD141 citations96
US5930603AJul 27, 1999
Method for producing a semiconductor device
FUJITSU LTD77 citations96
US5842628ADec 1, 1998
Wire bonding method, semiconductor device, capillary for wire bonding and ball bump forming method
FUJITSU LTD56 citations96
US6495773B1Dec 17, 2002
Wire bonded device with ball-shaped bonds
FUJITSU LTD38 citations93
US6856017B2Feb 15, 2005
Device having resin package and method of producing the same
FUJITSU LTD13 citations92
US6207477B1Mar 27, 2001
Semiconductor device having a ball grid array and a fabrication process thereof
FUJITSU LTD37 citations92
US7144754B2Dec 5, 2006
Device having resin package and method of producing the same
FUJITSU LTD1 citations63
US7251801B2Jul 31, 2007
Method of designing circuit board
FUJITSU LTD6 citations62
FUJITSU SEMICONDUCTOR LTD
2 patentsUS7863745B2Jan 4, 2011
Semiconductor device, manufacturing method of the semiconductor device, and mounting method of the semiconductor device
FUJITSU SEMICONDUCTOR LTD8 citations84
US9041186B2May 26, 2015
Encapsulated semiconductor chips with wiring including controlling chip and method of making the same
FUJITSU SEMICONDUCTOR LTD1 citations52