Inventor
YONEDA YOSHIYUKI
JP55 patents
⚠️ This page may combine multiple inventors who share the name “YONEDA YOSHIYUKI”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
FUJITSU LTD
41 patentsUS6376921B1Apr 23, 2002
Semiconductor device, method for fabricating the semiconductor device, lead frame and method for producing the lead frame
FUJITSU LTD120 citations99
US6255740B1Jul 3, 2001
Semiconductor device having a lead portion with outer connecting terminals
FUJITSU LTD122 citations99
US6072239AJun 6, 2000
Device having resin package with projections
FUJITSU LTD241 citations99
US5656550AAug 12, 1997
Method of producing a semicondutor device having a lead portion with outer connecting terminal
FUJITSU LTD366 citations99
US5625222AApr 29, 1997
Semiconductor device in a resin package housed in a frame having high thermal conductivity
FUJITSU LTD1,025 citations99
US6573121B2Jun 3, 2003
Semiconductor device, method for fabricating the semiconductor device, lead frame and method for producing the lead frame
FUJITSU LTD126 citations98
US6025650AFeb 15, 2000
Semiconductor device including a frame terminal
FUJITSU LTD220 citations98
US6794273B2Sep 21, 2004
Semiconductor device and manufacturing method thereof
FUJITSU LTD81 citations97
US6781224B2Aug 24, 2004
Semiconductor device and package including forming pyramid mount protruding through silicon substrate
FUJITSU LTD42 citations96
US6329711B1Dec 11, 2001
Semiconductor device and mounting structure
FUJITSU LTD122 citations96
US6159770ADec 12, 2000
Method and apparatus for fabricating semiconductor device
FUJITSU LTD212 citations96
US5930603AJul 27, 1999
Method for producing a semiconductor device
FUJITSU LTD77 citations96
US5804468ASep 8, 1998
Process for manufacturing a packaged semiconductor having a divided leadframe stage
FUJITSU LTD65 citations96
US5569625AOct 29, 1996
Process for manufacturing a plural stacked leadframe semiconductor device
FUJITSU LTD47 citations96
US5521432AMay 28, 1996
Semiconductor device having improved leads comprising palladium plated nickel
FUJITSU LTD84 citations96
US5497032AMar 5, 1996
Semiconductor device and lead frame therefore
FUJITSU LTD65 citations96
US6875638B2Apr 5, 2005
Manufacturing method of a semiconductor device incorporating a passive element and a redistribution board
FUJITSU LTD44 citations95
US5904506AMay 18, 1999
Semiconductor device suitable for testing
FUJITSU LTD21 citations93
US5767527AJun 16, 1998
Semiconductor device suitable for testing
FUJITSU LTD31 citations93
US5440170AAug 8, 1995
Semiconductor device having a die pad with rounded edges and its manufacturing method
FUJITSU LTD20 citations93
US7112889B1Sep 26, 2006
Semiconductor device having an alignment mark formed by the same material with a metal post
FUJITSU LTD36 citations92
US6995044B2Feb 7, 2006
Manufacturing method of a semiconductor device incorporating a passive element and a redistribution board
FUJITSU LTD36 citations92
US6856017B2Feb 15, 2005
Device having resin package and method of producing the same
FUJITSU LTD13 citations92
US6696754B2Feb 24, 2004
Semiconductor module including a plurality of semiconductor devices detachably
FUJITSU LTD20 citations92
US6511620B1Jan 28, 2003
Method of producing semiconductor devices having easy separability from a metal mold after molding
FUJITSU LTD35 citations92
US6472744B2Oct 29, 2002
Semiconductor module including a plurality of semiconductor devices detachably
FUJITSU LTD31 citations92
US6469370B1Oct 22, 2002
Semiconductor device and method of production of the semiconductor device
FUJITSU LTD54 citations92
US6207477B1Mar 27, 2001
Semiconductor device having a ball grid array and a fabrication process thereof
FUJITSU LTD37 citations92
US6069408AMay 30, 2000
Semiconductor device and method of manufacturing semiconductor device
FUJITSU LTD32 citations92
US5891758AApr 6, 1999
Semiconductor device and method for manufacturing semiconductor device
FUJITSU LTD23 citations92
US5750421AMay 12, 1998
Semiconductor device, carrier for carrying semiconductor device, and method of testing and producing semiconductor device
FUJITSU LTD27 citations92
US5666064ASep 9, 1997
Semiconductor device, carrier for carrying semiconductor device, and method of testing and producing semiconductor device
FUJITSU LTD25 citations92
US5475259ADec 12, 1995
Semiconductor device and carrier for carrying semiconductor device
FUJITSU LTD29 citations92
US5654243AAug 5, 1997
Process for fabricating a semiconductor device in a resin package housed in a frame having high conductivity
FUJITSU LTD16 citations82
US5399804AMar 21, 1995
Semiconductor device and method of producing the same
FUJITSU LTD16 citations82
US6905951B2Jun 14, 2005
Method of forming a device substrate and semiconductor package including a pyramid contact
FUJITSU LTD9 citations74
US6271583B1Aug 7, 2001
Semiconductor device having resin encapsulated package structure
FUJITSU LTD7 citations74
US5808357ASep 15, 1998
Semiconductor device having resin encapsulated package structure
FUJITSU LTD11 citations74
US5736428AApr 7, 1998
Process for manufacturing a semiconductor device having a stepped encapsulated package
FUJITSU LTD8 citations73
US7144754B2Dec 5, 2006
Device having resin package and method of producing the same
FUJITSU LTD1 citations63
US7251801B2Jul 31, 2007
Method of designing circuit board
FUJITSU LTD6 citations62
FUJITSU SEMICONDUCTOR LTD
3 patentsUS9076789B2Jul 7, 2015
Semiconductor device having a high frequency external connection electrode positioned within a via hole
FUJITSU SEMICONDUCTOR LTD8 citations84
US8759119B2Jun 24, 2014
Method of testing a semiconductor device and suctioning a semiconductor device in the wafer state
FUJITSU SEMICONDUCTOR LTD2 citations62
US7754534B2Jul 13, 2010
Semiconductor device and manufacturing method thereof
FUJITSU SEMICONDUCTOR LTD5 citations62
DAIICHI SEIYAKU CO
2 patentsPHARMACOPEIA DRUG DISCOVERY
2 patentsMACHINAGA NOBUO
1 patentNIPPON PAINT CO LTD
1 patentShowing the top 50 of 55 patents by PatentIndex Score.