Inventor

FURUNO MASAHIKO

JP4 patents

⚠️ This page may combine multiple inventors who share the name “FURUNO MASAHIKO”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

TAMURA SEISAKUSHO KK

3 patents

US6742701B2Jun 1, 2004

Bump forming method, presoldering treatment method, soldering method, bump forming apparatus, presoldering treatment device and soldering apparatus

TAMURA SEISAKUSHO KK26 citations90

US8042727B2Oct 25, 2011

Heater, reflow apparatus, and solder bump forming method and apparatus

TAMURA SEISAKUSHO KK10 citations78

US7350686B2Apr 1, 2008

Method for supplying solder

TAMURA SEISAKUSHO KK4 citations58

ONOZAKI JUNICHI

1 patent

US8104661B2Jan 31, 2012

Heating device, reflow device, heating method, and bump forming method

ONOZAKI JUNICHI0 citations32