Inventor
SON YOON-CHUL
KR33 patents
⚠️ This page may combine multiple inventors who share the name “SON YOON-CHUL”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
SAMSUNG ELECTRONICS CO LTD
24 patentsUS7663083B2Feb 16, 2010
Image sensor module having electric component and fabrication method thereof
SAMSUNG ELECTRONICS CO LTD16 citations84
US10475583B2Nov 12, 2019
Dielectric composites, and multi-layered capacitors and electronic devices comprising thereof
SAMSUNG ELECTRONICS CO LTD2 citations72
US9440853B2Sep 13, 2016
Hafnium telluride layered compounds, transparent and electrically conductive film, and electronic devices including the same
SAMSUNG ELECTRONICS CO LTD3 citations71
US9501013B2Nov 22, 2016
Heating member and fusing apparatus including the same
SAMSUNG ELECTRONICS CO LTD2 citations61
US9165701B2Oct 20, 2015
Resistance heating element and heating member and fusing device employing the same
SAMSUNG ELECTRONICS CO LTD3 citations61
US10650977B2May 12, 2020
Ceramic electronic component and method of manufacturing the same and electronic device
SAMSUNG ELECTRONICS CO LTD0 citations52
US10266407B2Apr 23, 2019
Electrically conductive thin films
SAMSUNG ELECTRONICS CO LTD0 citations52
US9809460B2Nov 7, 2017
Electrically conductive thin films containing Re2C
SAMSUNG ELECTRONICS CO LTD0 citations52
US9666324B2May 30, 2017
Transparent conductive thin film
SAMSUNG ELECTRONICS CO LTD0 citations52
US9648738B2May 9, 2017
Electrical conductors, production methods thereof, and electronic devices including the same
SAMSUNG ELECTRONICS CO LTD0 citations52
US9546415B2Jan 17, 2017
Composite transparent electrodes
SAMSUNG ELECTRONICS CO LTD1 citations52
US8344606B2Jan 1, 2013
Field emission device
SAMSUNG ELECTRONICS CO LTD0 citations52
US10643791B2May 5, 2020
Dielectric material, multi-layered capacitors and electronic devices comprising the same
SAMSUNG ELECTRONICS CO LTD0 citations51
US10138125B2Nov 27, 2018
Electrically conductive thin films
SAMSUNG ELECTRONICS CO LTD0 citations51
US9899209B2Feb 20, 2018
Electrically conductive thin films
SAMSUNG ELECTRONICS CO LTD0 citations51
US9809455B2Nov 7, 2017
Conductive material and electrical device including the same
SAMSUNG ELECTRONICS CO LTD0 citations51
US9508987B2Nov 29, 2016
Composite anode active material, method of preparing the composite anode active material, and lithium battery including the composite anode active material
SAMSUNG ELECTRONICS CO LTD0 citations51
US9052655B2Jun 9, 2015
Heating member including a base polymer and fusing apparatus including the same
SAMSUNG ELECTRONICS CO LTD1 citations51
US9037063B2May 19, 2015
Method of forming thin resistive heating layer, heating member including the thin resistive heating layer, and fusing unit including the heating member
SAMSUNG ELECTRONICS CO LTD0 citations51
US9002253B2Apr 7, 2015
Heating member and fusing device including the same
SAMSUNG ELECTRONICS CO LTD0 citations51
US8048395B2Nov 1, 2011
Method of coating catalyst metal layer by using nucleic acid and method of forming nanocarbon by using the method of coating the catalyst metal layer
SAMSUNG ELECTRONICS CO LTD0 citations51
US10099938B2Oct 16, 2018
Electrically conductive thin films
SAMSUNG ELECTRONICS CO LTD1 citations49
US10395790B2Aug 27, 2019
Transparent conductor and electronic device including the same
SAMSUNG ELECTRONICS CO LTD0 citations41
US9837179B2Dec 5, 2017
Electrically conductive thin films
SAMSUNG ELECTRONICS CO LTD0 citations41
SON YOON-CHUL
3 patentsUS8593049B2Nov 26, 2013
Field electron emitter, field electron emission device including the same, and method of manufacturing the field electron emitter
SON YOON-CHUL2 citations59
US8531096B2Sep 10, 2013
Field emission device and method of manufacturing the same
SON YOON-CHUL1 citations50
US8314539B2Nov 20, 2012
Field electron emitter including nucleic acid-coated carbon nanotube and method of manufacturing the same
SON YOON-CHUL0 citations49
KANG SUNG KWON
2 patentsUS8691685B2Apr 8, 2014
Prevention and control of intermetallic alloy inclusions that form during reflow of Pb free, Sn rich, solders in contacts in microelectronic packaging in integrated circuit contact structures where electroless Ni(P) metallization is present
KANG SUNG KWON0 citations47
US8679964B2Mar 25, 2014
Prevention and control of intermetallic alloy inclusions
KANG SUNG KWON0 citations47