P

Inventor

LEE SANG-EUI

KR23 patents
⚠️ This page may combine multiple inventors who share the name “LEE SANG-EUI”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

SAMSUNG ELECTRONICS CO LTD

15 patents
US9701898B2Jul 11, 2017

Methods of grinding semiconductor nanocrystal polymer composite particles

SAMSUNG ELECTRONICS CO LTD4 citations73
US10020091B2Jul 10, 2018

Conductive composite, manufacturing method thereof, and electronic device including same

SAMSUNG ELECTRONICS CO LTD2 citations68
US8355661B2Jan 15, 2013

Fusing device including resistive heating layer and image forming apparatus including the fusing device

SAMSUNG ELECTRONICS CO LTD2 citations62
US8055177B2Nov 8, 2011

Heating member including resistive heating layer and fusing device comprising the heating member

SAMSUNG ELECTRONICS CO LTD3 citations62
US10961414B2Mar 30, 2021

Polishing slurry, method of manufacturing the same, and method of manufacturing semiconductor device

SAMSUNG ELECTRONICS CO LTD0 citations61
US9501013B2Nov 22, 2016

Heating member and fusing apparatus including the same

SAMSUNG ELECTRONICS CO LTD2 citations61
US9165701B2Oct 20, 2015

Resistance heating element and heating member and fusing device employing the same

SAMSUNG ELECTRONICS CO LTD3 citations61
US11021804B2Jun 1, 2021

Plating solution and metal composite and method of manufacturing the same

SAMSUNG ELECTRONICS CO LTD1 citations59
US10115496B2Oct 30, 2018

Compositions for preparing electrically conductive composites, composites prepared therefrom, and electronic devices including the same

SAMSUNG ELECTRONICS CO LTD0 citations51
US9804323B2Oct 31, 2017

Light conversion device and manufacturing method thereof, and light source unit including the light conversion device

SAMSUNG ELECTRONICS CO LTD0 citations51
US9052655B2Jun 9, 2015

Heating member including a base polymer and fusing apparatus including the same

SAMSUNG ELECTRONICS CO LTD1 citations51
US9037063B2May 19, 2015

Method of forming thin resistive heating layer, heating member including the thin resistive heating layer, and fusing unit including the heating member

SAMSUNG ELECTRONICS CO LTD0 citations51
US9002253B2Apr 7, 2015

Heating member and fusing device including the same

SAMSUNG ELECTRONICS CO LTD0 citations51
US10808169B2Oct 20, 2020

Methods of grinding semiconductor nanocrystal polymer composite particles

SAMSUNG ELECTRONICS CO LTD0 citations42
US10217551B2Feb 26, 2019

Magnetic sheet, method of making the same, and loud speaker including the same

SAMSUNG ELECTRONICS CO LTD0 citations35

LEE SANG-EUI

2 patents

JUN SHIN AE

1 patent

YOUNGBAGS CM CO LTD

1 patent

KIM HA-JIN

1 patent

KO YOUNG-CHUL

1 patent

KIM DONG-OUK

1 patent

LEE SANG EUI

1 patent