Inventor

RICHLING WAYNE PATRICK

US2 patents

Patents

2 patents

US7208843B2Apr 24, 2007

Routing design to minimize electromigration damage to solder bumps

AVAGO TECHNOLOGIES GENERAL IP21 citations87

US7253528B2Aug 7, 2007

Trace design to minimize electromigration damage to solder bumps

AVAGO TECHNOLOGIES GENERAL IP7 citations68