Inventor

ANDO SETSUO

JP6 patents

⚠️ This page may combine multiple inventors who share the name “ANDO SETSUO”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

HITACHI LTD

3 patents

US4963974AOct 16, 1990

Electronic device plated with gold by means of an electroless gold plating solution

HITACHI LTD74 citations95

US5202151AApr 13, 1993

Electroless gold plating solution, method of plating with gold by using the same, and electronic device plated with gold by using the same

HITACHI LTD29 citations91

US5198273AMar 30, 1993

Electroless gold plating solution and method for plating gold therewith

HITACHI LTD17 citations72

HITACHI METALS LTD

3 patents

US6866765B2Mar 15, 2005

Electrolytic copper-plated R-T-B magnet and plating method thereof

HITACHI METALS LTD6 citations70

US10312604B2Jun 4, 2019

Crimping terminal and electric wire with crimping terminal

HITACHI METALS LTD1 citations61

US10597790B2Mar 24, 2020

Refined copper, method of producing refined copper, electric wire and method of manufacturing electric wire

HITACHI METALS LTD0 citations40