Inventor
MORINAGA YUJI
JP14 patents
Patents
14 patentsUS10243477B2Mar 26, 2019
Semiconductor device having a bypass capacitor
SHINDENGEN ELECTRIC MFG2 citations71
US10083844B2Sep 25, 2018
Method of manufacturing bonded body
SHINDENGEN ELECTRIC MFG6 citations70
US10319704B2Jun 11, 2019
Semiconductor module
SHINDENGEN ELECTRIC MFG1 citations61
US11404353B2Aug 2, 2022
Electronic device, connection body, and manufacturing method for electronic device
SHINDENGEN ELECTRIC MFG0 citations60
US10615092B2Apr 7, 2020
Electronic device
SHINDENGEN ELECTRIC MFG1 citations60
US11211311B2Dec 28, 2021
Electronic device and connection body
SHINDENGEN ELECTRIC MFG0 citations50
US10910292B2Feb 2, 2021
Electronic device and connection body
SHINDENGEN ELECTRIC MFG0 citations50
US10896868B2Jan 19, 2021
Electronic device and connector
SHINDENGEN ELECTRIC MFG0 citations50
US10159166B2Dec 18, 2018
Heat dissipating structure
SHINDENGEN ELECTRIC MFG1 citations50
US9704828B2Jul 11, 2017
Semiconductor module
SHINDENGEN ELECTRIC MFG1 citations50
US10461042B2Oct 29, 2019
Semiconductor module
SHINDENGEN ELECTRIC MFG0 citations40
US10251256B2Apr 2, 2019
Heat dissipating structure
SHINDENGEN ELECTRIC MFG0 citations40
US10600712B2Mar 24, 2020
Electronic device
SHINDENGEN ELECTRIC MFG0 citations39
US10199486B2Feb 5, 2019
Semiconductor device
SHINDENGEN ELECTRIC MFG0 citations39