Inventor
COURTNEY MARK G
US17 patents
Patents
17 patentsUS6333563B1Dec 25, 2001
Electrical interconnection package and method thereof
IBM85 citations97
US5623394AApr 22, 1997
Apparatus for cooling of chips using a plurality of customized thermally conductive materials
IBM121 citations97
US6283359B1Sep 4, 2001
Method for enhancing fatigue life of ball grid arrays
IBM53 citations96
US5968670AOct 19, 1999
Enhanced ceramic ball grid array using in-situ solder stretch with spring
IBM63 citations96
US5881944AMar 16, 1999
Multi-layer solder seal band for semiconductor substrates
IBM53 citations96
US5881945AMar 16, 1999
Multi-layer solder seal band for semiconductor substrates and process
IBM57 citations96
US5604978AFeb 25, 1997
Method for cooling of chips using a plurality of materials
IBM67 citations95
US6333104B1Dec 25, 2001
Conductive polymer interconnection configurations
IBM21 citations92
US6278184B1Aug 21, 2001
Solder disc connection
IBM35 citations92
US6253986B1Jul 3, 2001
Solder disc connection
IBM25 citations92
US6158644ADec 12, 2000
Method for enhancing fatigue life of ball grid arrays
IBM43 citations92
US6070321AJun 6, 2000
Solder disc connection
IBM20 citations92
US5975409ANov 2, 1999
Ceramic ball grid array using in-situ solder stretch
IBM36 citations92
US5964396AOct 12, 1999
Enhanced ceramic ball grid array using in-situ solder stretch with clip
IBM36 citations92
US4715430ADec 29, 1987
Environmentally secure and thermally efficient heat sink assembly
IBM31 citations86
US6858111B2Feb 22, 2005
Conductive polymer interconnection configurations
IBM9 citations73
US6552529B1Apr 22, 2003
Method and apparatus for interim assembly electrical testing of circuit boards
IBM3 citations63