Inventor
STALTER KATHLEEN A
US18 patents
Patents
18 patentsUS6258625B1Jul 10, 2001
Method of interconnecting electronic components using a plurality of conductive studs
IBM243 citations99
US6270363B1Aug 7, 2001
Z-axis compressible polymer with fine metal matrix suspension
IBM105 citations98
US6283359B1Sep 4, 2001
Method for enhancing fatigue life of ball grid arrays
IBM53 citations96
US5968670AOct 19, 1999
Enhanced ceramic ball grid array using in-situ solder stretch with spring
IBM63 citations96
US6278184B1Aug 21, 2001
Solder disc connection
IBM35 citations92
US6253986B1Jul 3, 2001
Solder disc connection
IBM25 citations92
US6218629B1Apr 17, 2001
Module with metal-ion matrix induced dendrites for interconnection
IBM18 citations92
US6216937B1Apr 17, 2001
Process and apparatus to remove closely spaced chips on a multi-chip module
IBM31 citations92
US6158644ADec 12, 2000
Method for enhancing fatigue life of ball grid arrays
IBM43 citations92
US6070321AJun 6, 2000
Solder disc connection
IBM20 citations92
US5975409ANov 2, 1999
Ceramic ball grid array using in-situ solder stretch
IBM36 citations92
US5964396AOct 12, 1999
Enhanced ceramic ball grid array using in-situ solder stretch with clip
IBM36 citations92
US6220499B1Apr 24, 2001
Method for assembling a chip carrier to a semiconductor device
IBM30 citations91
US6984792B2Jan 10, 2006
Dielectric interposer for chip to substrate soldering
IBM9 citations74
US6548909B2Apr 15, 2003
Method of interconnecting electronic components using a plurality of conductive studs
IBM11 citations74
US6360938B2Mar 26, 2002
Process and apparatus to remove closely spaced chips on a multi-chip module
IBM12 citations73
US6657313B1Dec 2, 2003
Dielectric interposer for chip to substrate soldering
IBM7 citations71
US6584684B2Jul 1, 2003
Method for assembling a carrier and a semiconductor device
IBM3 citations62