Inventor
PARK SEYANG
US4 patents
⚠️ This page may combine multiple inventors who share the name “PARK SEYANG”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
NOVELLUS SYSTEMS INC
3 patentsUS7799684B1Sep 21, 2010
Two step process for uniform across wafer deposition and void free filling on ruthenium coated wafers
NOVELLUS SYSTEMS INC22 citations90
US7442267B1Oct 28, 2008
Anneal of ruthenium seed layer to improve copper plating
NOVELLUS SYSTEMS INC25 citations90
US7405157B1Jul 29, 2008
Methods for the electrochemical deposition of copper onto a barrier layer of a work piece
NOVELLUS SYSTEMS INC29 citations89