Inventor
TSURUTA KAICHI
JP20 patents
⚠️ This page may combine multiple inventors who share the name “TSURUTA KAICHI”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
SENJU METAL INDUSTRY CO
13 patentsUS6919634B2Jul 19, 2005
Solder ball assembly, a method for its manufacture, and a method of forming solder bumps
SENJU METAL INDUSTRY CO28 citations92
US7793820B2Sep 14, 2010
Solder preform and a process for its manufacture
SENJU METAL INDUSTRY CO31 citations91
US10675719B2Jun 9, 2020
Joining member, solder material, solder paste, formed solder, flux coated material, and solder joint
SENJU METAL INDUSTRY CO3 citations73
US7112888B2Sep 26, 2006
Solder ball assembly for bump formation and method for its manufacture
SENJU METAL INDUSTRY CO10 citations73
US10722965B2Jul 28, 2020
Solder ball supplying method, solder ball supplying device, and solder bump forming method
SENJU METAL INDUSTRY CO2 citations72
US10111342B2Oct 23, 2018
Solder transfer sheet, solder bump, and solder precoating method using solder transfer sheet
SENJU METAL INDUSTRY CO2 citations71
US10265808B2Apr 23, 2019
Flux for resin flux cored solder, flux for flux coated solder, resin flux cored solder and flux coated solder
SENJU METAL INDUSTRY CO4 citations69
US10137538B2Nov 27, 2018
Liquid coating device
SENJU METAL INDUSTRY CO3 citations69
US10780531B2Sep 22, 2020
Solder ball, solder joint, and joining method
SENJU METAL INDUSTRY CO1 citations59
US10780530B2Sep 22, 2020
Solder ball, solder joint, and joining method
SENJU METAL INDUSTRY CO1 citations59
US10391589B2Aug 27, 2019
Flux applying device
SENJU METAL INDUSTRY CO1 citations59
US11712760B2Aug 1, 2023
Layered bonding material, semiconductor package, and power module
SENJU METAL INDUSTRY CO0 citations50
US10121606B2Nov 6, 2018
Method of manufacturing an electrode for an energy storage device
SENJU METAL INDUSTRY CO0 citations47