Inventor
MUSANTE CHARLES F
US32 patents
⚠️ This page may combine multiple inventors who share the name “MUSANTE CHARLES F”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
IBM
23 patentsUS7759755B2Jul 20, 2010
Anti-reflection structures for CMOS image sensors
IBM45 citations96
US8003425B2Aug 23, 2011
Methods for forming anti-reflection structures for CMOS image sensors
IBM20 citations93
US8023021B2Sep 20, 2011
High efficiency CMOS image sensor pixel employing dynamic voltage supply
IBM7 citations84
US7928527B2Apr 19, 2011
Delamination and crack resistant image sensor structures and methods
IBM9 citations84
US10090180B2Oct 2, 2018
Package assembly for thin wafer shipping and method of use
IBM5 citations82
US9543175B2Jan 10, 2017
Package assembly for thin wafer shipping and method of use
IBM6 citations82
US10468280B2Nov 5, 2019
Package assembly for thin wafer shipping and method of use
IBM3 citations71
US9953940B2Apr 24, 2018
Corrosion resistant aluminum bond pad structure
IBM1 citations63
US9165831B2Oct 20, 2015
Dice before grind with backside metal
IBM2 citations63
US8742560B2Jun 3, 2014
Anti-reflection structures for CMOS image sensors
IBM2 citations63
US7655966B2Feb 2, 2010
High efficiency CMOS image sensor pixel employing dynamic voltage supply
IBM4 citations63
US8009216B2Aug 30, 2011
Pixel sensor cell with frame storage capability
IBM5 citations62
US8009215B2Aug 30, 2011
Pixel sensor cell with frame storage capability
IBM3 citations62
US10615137B2Apr 7, 2020
Corrosion resistant aluminum bond pad structure
IBM0 citations52
US10204877B2Feb 12, 2019
Corrosion resistant aluminum bond pad structure
IBM0 citations52
US9059111B2Jun 16, 2015
Reliable back-side-metal structure
IBM0 citations52
US8878326B2Nov 4, 2014
Imager microlens structure having interfacial region for adhesion of protective layer
IBM0 citations52
US9716010B2Jul 25, 2017
Handle wafer
IBM1 citations51
US8912091B2Dec 16, 2014
Backside metal ground plane with improved metal adhesion and design structures
IBM1 citations51
US10784137B2Sep 22, 2020
Package assembly for thin wafer shipping and method of use
IBM0 citations50
US10622235B2Apr 14, 2020
Package assembly for thin wafer shipping and method of use
IBM0 citations50
US9607929B2Mar 28, 2017
Tsv wafer with improved fracture strength
IBM0 citations48
US9312205B2Apr 12, 2016
Methods of forming a TSV wafer with improved fracture strength
IBM0 citations48
ADKISSON JAMES W
4 patentsUS8409904B2Apr 2, 2013
Methods for forming anti-reflection structures for CMOS image sensors
ADKISSON JAMES W6 citations84
US8138534B2Mar 20, 2012
Anti-reflection structures for CMOS image sensors
ADKISSON JAMES W9 citations84
US8298853B2Oct 30, 2012
CMOS pixel sensor cells with poly spacer transfer gates and methods of manufacture
ADKISSON JAMES W6 citations72
US8716771B2May 6, 2014
Anti-reflection structures for CMOS image sensors
ADKISSON JAMES W0 citations52