Inventor
THOMAS DAVID C
US32 patents
⚠️ This page may combine multiple inventors who share the name “THOMAS DAVID C”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
IBM
16 patentsUS5420455AMay 30, 1995
Array fuse damage protection devices and fabrication method
IBM49 citations95
US5523253AJun 4, 1996
Array protection devices and fabrication method
IBM28 citations92
US6982227B2Jan 3, 2006
Single and multilevel rework
IBM16 citations91
US6674168B1Jan 6, 2004
Single and multilevel rework
IBM17 citations91
US6340601B1Jan 22, 2002
Method for reworking copper metallurgy in semiconductor devices
IBM26 citations87
US9548349B2Jan 17, 2017
Semiconductor device with metal extrusion formation
IBM2 citations72
US4833517AMay 23, 1989
Theta device with improved base contact
IBM8 citations71
US9275868B2Mar 1, 2016
Uniform roughness on backside of a wafer
IBM2 citations62
US8003536B2Aug 23, 2011
Electromigration resistant aluminum-based metal interconnect structure
IBM2 citations62
US9087839B2Jul 21, 2015
Semiconductor structures with metal lines
IBM2 citations61
US9825119B2Nov 21, 2017
Semiconductor device with metal extrusion formation
IBM0 citations51
US9825120B2Nov 21, 2017
Semiconductor device with metal extrusion formation
IBM0 citations51
US9059258B2Jun 16, 2015
Controlled metal extrusion opening in semiconductor structure and method of forming
IBM0 citations51
US9006703B2Apr 14, 2015
Method for reducing lateral extrusion formed in semiconductor structures and semiconductor structures formed thereof
IBM0 citations50
US9607929B2Mar 28, 2017
Tsv wafer with improved fracture strength
IBM0 citations48
US9312205B2Apr 12, 2016
Methods of forming a TSV wafer with improved fracture strength
IBM0 citations48