P

Inventor

TSENG CHUNG-CHUAN

TW48 patents
⚠️ This page may combine multiple inventors who share the name “TSENG CHUNG-CHUAN”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

TAIWAN SEMICONDUCTOR MFG CO LTD

44 patents
US10546917B1Jan 28, 2020

Trench capacitor layout structure and method of forming same background

TAIWAN SEMICONDUCTOR MFG CO LTD22 citations94
US10679889B2Jun 9, 2020

Method for manufacturing semiconductor structure

TAIWAN SEMICONDUCTOR MFG CO LTD5 citations84
US11581400B2Feb 14, 2023

Method of making a trench capacitor and trench capacitor

TAIWAN SEMICONDUCTOR MFG CO LTD1 citations73
US12057467B2Aug 6, 2024

Image sensor device and methods of forming the same

TAIWAN SEMICONDUCTOR MFG CO LTD2 citations72
US11894411B2Feb 6, 2024

Image sensor device and methods of forming the same

TAIWAN SEMICONDUCTOR MFG CO LTD2 citations72
US11515355B2Nov 29, 2022

Image sensor device and methods of forming the same

TAIWAN SEMICONDUCTOR MFG CO LTD2 citations72
US11488993B2Nov 1, 2022

Image sensor device

TAIWAN SEMICONDUCTOR MFG CO LTD2 citations71
US10777591B2Sep 15, 2020

Image sensor device

TAIWAN SEMICONDUCTOR MFG CO LTD4 citations71
US11329125B2May 10, 2022

Integrated circuit including trench capacitor

TAIWAN SEMICONDUCTOR MFG CO LTD2 citations70
US9673248B2Jun 6, 2017

Image sensing device and manufacturing method thereof

TAIWAN SEMICONDUCTOR MFG CO LTD3 citations69
US12125868B2Oct 22, 2024

Image sensors with dummy pixel structures

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US11961866B2Apr 16, 2024

Method of making an image sensor with sidewall protection

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US11587824B2Feb 21, 2023

Method for manufacturing semiconductor structure

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US11545518B2Jan 3, 2023

Image sensor and method for fabricating the same

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US11476288B2Oct 18, 2022

Infrared image sensor component manufacturing method

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US11127625B2Sep 21, 2021

Semiconductor structure and related method

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US10438838B2Oct 8, 2019

Semiconductor structure and related method

TAIWAN SEMICONDUCTOR MFG CO LTD1 citations62
US9281336B2Mar 8, 2016

Mechanisms for forming backside illuminated image sensor device structure

TAIWAN SEMICONDUCTOR MFG CO LTD2 citations62
US12439713B2Oct 7, 2025

Image sensor device

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations61
US12364028B2Jul 15, 2025

Image sensor device and methods of forming the same

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations61
US12211838B2Jan 28, 2025

Device including MIM capacitor and resistor

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations61
US11784199B2Oct 10, 2023

Image sensor device

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations61
US11756955B2Sep 12, 2023

Device including MIM capacitor and resistor

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations61
US12495558B2Dec 9, 2025

Integrated circuit including trench capacitor

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations60
US11996439B2May 28, 2024

Integrated circuit including trench capacitor

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations60
US12369420B2Jul 22, 2025

Methods for forming image sensors

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations59
US11626442B2Apr 11, 2023

Methods for forming image sensors

TAIWAN SEMICONDUCTOR MFG CO LTD1 citations59
US9530690B2Dec 27, 2016

Metal pad structure over TSV to reduce shorting of upper metal layer

TAIWAN SEMICONDUCTOR MFG CO LTD1 citations59
US12514010B2Dec 30, 2025

Semiconductor device

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations58
US11670650B2Jun 6, 2023

Semiconductor device and method of manufacturing the same

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations58
US10847607B2Nov 24, 2020

Method of making a trench capacitor

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations52
US9627249B2Apr 18, 2017

Semiconductor structure and method for manufacturing the same

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations52
US9620551B2Apr 11, 2017

Mechanisms for forming backside illuminated image sensor device structure

TAIWAN SEMICONDUCTOR MFG CO LTD1 citations52
US11626444B2Apr 11, 2023

Image sensors with dummy pixel structures

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations51
US10854658B2Dec 1, 2020

Image sensor with sidewall protection and method of making same

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations51
US10553489B2Feb 4, 2020

Partitioned wafer and semiconductor die

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations51
US10453881B2Oct 22, 2019

Infrared image sensor component

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations51
US9905466B2Feb 27, 2018

Wafer partitioning method and device formed

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations51
US9871067B2Jan 16, 2018

Infrared image sensor component

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations51
US9691807B2Jun 27, 2017

CMOS image sensor structure

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations51
US9287303B1Mar 15, 2016

CMOS image sensor structure

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations51
US9984971B2May 29, 2018

Methods of forming metal pad structures over TSVS to reduce shorting of upper metal layers

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations50
US9524997B1Dec 20, 2016

Semiconductor device having seal ring

TAIWAN SEMICONDUCTOR MFG CO LTD1 citations50
US9699897B2Jul 4, 2017

Pad structure

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations42

INVENSAS CORP

2 patents

TAIWAN SEMICONDUCTOR MFG

1 patent

TESSERA INC

1 patent