Inventor
DAVIS ROBIN
US14 patents
⚠️ This page may combine multiple inventors who share the name “DAVIS ROBIN”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
DECA TECH USA INC
13 patentsUS12205881B2Jan 21, 2025
Semiconductor assembly comprising a 3D block and method of making the same
DECA TECH USA INC2 citations74
US11616003B2Mar 28, 2023
Stackable fully molded semiconductor structure with through silicon via (TSV) vertical interconnects
DECA TECH USA INC2 citations71
US12469776B2Nov 11, 2025
Semiconductor assembly comprising a 3D block and method of making the same
DECA TECH USA INC0 citations62
US12438065B2Oct 7, 2025
Fully molded semiconductor structure with through silicon via (TSV) vertical interconnects
DECA TECH USA INC0 citations61
US12170261B2Dec 17, 2024
Molded direct contact interconnect structure without capture pads and method for the same
DECA TECH USA INC0 citations61
US12057373B2Aug 6, 2024
Stackable fully molded semiconductor structure with through silicon via (TSV) vertical interconnects and method of making the same
DECA TECH USA INC0 citations61
US11973051B2Apr 30, 2024
Molded direct contact interconnect structure without capture pads and method for the same
DECA TECH USA INC0 citations61
US11728248B2Aug 15, 2023
Fully molded semiconductor structure with through silicon via (TSV) vertical interconnects
DECA TECH USA INC1 citations61
US12500197B2Dec 16, 2025
Encapsulant-defined land grid array (LGA) package and method for making the same
DECA TECH USA INC0 citations51
US12500198B2Dec 16, 2025
Quad flat no-lead (QFN) package with tie bars and direct contact interconnect build-up structure and method for making the same
DECA TECH USA INC0 citations51
US12300561B2May 13, 2025
Fully molded structure with multi-height components comprising backside conductive material and method for making the same
DECA TECH USA INC0 citations51
US12062550B2Aug 13, 2024
Molded direct contact interconnect substrate and methods of making same
DECA TECH USA INC0 citations51
US11749534B1Sep 5, 2023
Quad flat no-lead (QFN) package without leadframe and direct contact interconnect build-up structure and method for making the same
DECA TECH USA INC0 citations51